公司名称：天津西美半导体材料有限公司

CM-S301主要由各种助剂如高分子、活性剂等组成，特别适用于碳化硼、氧化铝和金刚石研磨液的悬浮，具有稳定性和分散性良好，去除率高、表面粗糙度小以及对工件无损伤等优点。即使在稀释倍率很高的情况下使用，仍具有很好的研磨效率和使用寿命。
CM-S301 is mainly composed of some kinds of additives such as polymer, active agent and so on, which facilitate to suspend of boron carbide , aluminium oxide and diamond polishing agent. It has excellent particle stability, dispersal, and possesses a high removal rate, good surface effects and damage-free polishing. Even when used at high dilutions, still has excellent processing efficiency and long slurry life.

项目 Item
外观 Appearance 胶体colloid
颜色 Colour 浅色 tint
pH (20℃) 11.0±0.5
比重 Specific gravity (20℃) 1.25±0.05
粘度 Viscosity (20℃，cps) ≥10
杀菌剂含量 Biocide Content (ppm) <500
用途 Application 研磨抛光 lapping and polishing
包装 Package 25kg
符合RoHS标准 RoHS compliant