公司名称：天津西美半导体材料有限公司

CM-T70适用于半导体材料如硅片，蓝宝石，锗片，砷化镓，碳化硅，铌酸锂，钽酸锂，光学玻璃，特殊物体等的研磨抛光加工过程。
CM-T70 can applied to the grinding and polishing process of semiconductor material such as silicon wafer, sapphire, germanium wafers, GaAs, SiC, LiTaO3, LiNbO3 and other oxid crystal.


项目 Item CM-T70
软化点 softening point (℃) >70
粘结强度 Adhensive strenght(N/mm2) 6.0
比重 Specific gravity (25℃) 1.03±0.02
针入度 Needle penetration (200g/60s) 10
包装 package 20g, 100g