公司名称：天津西美半导体材料有限公司

CM-S600主要由高纯度胶态二氧化硅组成，特别适用于各种蓝宝石材料的抛光，二氧化硅抛光液中颗粒大小的分布范围狭窄，产品储存温度范围大,具有的高稳定性、不腐蚀设备、粘度小、使用后容易清洗等优点。
CM-S600 is a colloidal silica slurry developed especially for polishing all kinds of sapphire materials, silica polishing liquid is narrow particle size distribution ，large range of product storage temperature, high stability, anti-corrosion equipment, low viscosity and easy to clean after used, etc.

型号Type
项目 Item 40 80 100 双抛
SiO2含量Content of SiO2 (%) 15±2 35±2 35±2 35±2
pH (20℃) 11.0±0.5 12.0±0.5 12.0±0.5 12.0±0.5
比重 Specific gravity (20℃) 1.09±0.02 1.23±0.02 1.23±0.02 1.23±0.02
粘度 Viscosity (20℃，cps) ≤18 ≤18 ≤18 ≤18
碱游离度
Free Alkalinity as Na2O% m/m <0.2 <0.2 <0.2 <0.2
平均粒径Average Particle Size (nm) 20-30 34-52 50-70 50-70
杀菌剂含量 Biocide Content (ppm) <200 <200 <200 <200
用途
Application 精抛
Final polishing 粗抛
First polishing 粗抛
First polishing 双抛
Double polishing
包装 Package 5kg, 25kg, 260kg, 1T
符合RoHS标准 RoHS compliant