公司名称：峨眉山市峨半高纯材料有限公司

规格：
高纯锡：99.999% Sn-5N-I-15
检测杂质：Ag, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Zn
杂质总含量：≤10ppm
高纯锡：99.9999% Sn-6N-I-16
检测杂质：Ag, Al, Au, Ca, Co, Cu, Fe, Mg, Ni, Zn
杂质总含量：≤1ppm
高纯锡：99.99999% Sn-7N-I-17
检测杂质：Ag, Al, Au, Ca, Cu, Fe, Mg, Ni, Zn
杂质总含量：≤0.1ppm
用途：主要用于制备化合物半导体、高纯合金、超导材料、焊料以及化合物半导体的掺杂剂。
包装：涤纶薄膜包装后双层复合膜真空封装或直接玻璃管真空封装。
Specification:
High purity Sn: 99.999% Sn-5N-I-15
Testing impurity: Ag, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Zn
Total impurity content: ≤10ppm
High purity Sn: 99.9999% Sn-6N-I-16
Testing impurity: Ag, Al, Au, Ca, Co, Cu, Fe, Mg, Ni, Zn
Total impurity content: ≤1ppm
High purity Sn: 99.99999% Sn-7N-I-17
Testing impurity: Ag, Al, Au, Ca, Cu, Fe, Mg, Ni, Zn
Total impurity content: ≤0.1ppm
Application: Tin is used in the manufacture of compound semiconductor, high purity alloy, superconducting material, solder and as a dopant of compound semiconductor.
Package: Packed with terylene film, and double poly-film with vacuum encapsulation. Packed with glass tube with vacuum encapsulation directly.
注：产品实际价格以询价为准！