公司名称：胶水公司

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led 灌封胶 led 灌封胶 led 灌封胶 led 灌封胶 led 灌封胶 led 灌封胶 led 灌封胶 led 灌封胶
led 灌封胶 led 灌封胶 led 灌封胶 led 灌封胶 led 灌封胶 led 灌封胶 led 灌封胶 led 灌封胶
液态封装树酯具有可靠性佳、内应力极低、颗粒极细小等特性,用于涂布于芯片四周以保护组件。常用于BGA、CSP、覆晶等封装应用