公司名称：胶水公司

ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/ABLEBOND 85-1电子组装/工业胶水/电子组装胶水/工业用胶

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乐泰 ABLESTIK 85-1 adhesive is designed for hybrid applicationswhere silver migration is a critical concern.
MIL-STD-883
乐泰 ABLESTIK 85-1 meets the requirements of MIL-STD-883,Method 5011.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Work Life @ 25°C, days 2
Shelf Life @ -40°C (from date of manufacture), days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 150°C
Alternate Cure Schedule
2 hours @ 125°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures
Storage
Store product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or greaterthan minus (-)40 °C can adversely affect product properties. 乐泰 ABLESTIK 85-1胶粘剂专为混合应用而设计银迁移是一个关键问题。
MIL-STD-883
乐泰 ABLESTIK 85-1符合MIL-STD-883的要求，
方法5011。
固化材料的典型特性
工作生活@ 25°C，第2天
保质期@ -40°C（制造日期），第365天
典型的固化性能
治愈时间表
150℃下1小时
替代治疗时间表
125°C下2小时
以上治疗方案是指导