公司名称：乐泰|乐泰胶水

STYCAST 50300HT乐泰胶水,环氧树脂胶
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Eccobond 50300HT球顶设计用于将环氧树脂层压板和类似基底上的引线接合裸芯片封装在一起。该单组分材料的配方可确保使用寿命长，使用时粘度非常稳定。 建议用于具有高线材外形的IC和必须控制固化期间球顶部扩散的应用。
典型的固化性能
推荐治疗时间2小时@ 150°C
低应力固化时间表在120°C + 1小时@ 150°C时
存储
将产品存放在未开封的容器中，干燥处。存储信息可能在产品容器标签上显示。*佳存储：-40至0°C从容器中取出的物质在使用过程中可能会受到污染。 不要将产品返回原来的容器。
Eccobond 50300HT glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates.The formulation of this single component material ensures a long pot and a very stable viscosity during use. It is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled.
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule2 hours @ 150°C
Low Stress Cure Schedule1 hour @ 120°C + 1 hour @ 150°C
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product container labeling.Optimal Storage : -40 to 0 °C Material removed from containers may be contaminated during use. Do not return product to the original container