公司名称：乐泰|乐泰胶水

乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶
乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶乐泰 ABLESTIK ABL 8352L乐泰胶水，芯片附着胶
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乐泰 ABLESTIK ABL 8352L导电芯片附着胶适用于高可靠性封装应用。 该材料适用于以薄型封装将介质连接到大型模具。
典型的固化性能
治疗时间表在175°C时，可以在175°C + 30分钟内升温至30分钟
替代治疗Schedule 1小时@ 200°C
存储
将产品存放在未开封的容器中，干燥处。 存储信息可能在产品容器标签上显示。*佳存储：-40°C。 储存在低于（ - ）40°C或更高于 - （ - ）40°C）可能会对产品性能产生不利影响。从容器中取出的材料在使用过程中可能会受到污染。不要将产品返回原始容器。
乐泰 ABLESTIK ABL 8352L electrically conductive die attach adhesive is designed for high reliability package applications . This material is suitable for bonding medium to large dies in thin packages.
TYPICAL CURING PERFORMANCE
Cure Schedule30 minute ramp to 175°C + 30 minutes @ 175°C
Alternate Cure Schedule1 hour @ 200°C
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product properties.Material removed from containers may be contaminated during use.Do not return product to the original container