ABLEBOND 3003
发布时间:2024年10月13日
详细说明
ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003
ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003
ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003 ABLEBOND 3003
ABLEBOND 3003 adhesive is designed for lid attach in flip
chip BGA applications. The combination of product features
result in superior flip chip BGA reliability.
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