ABLEBOND 2030SC
发布时间:2024年10月13日
详细说明
ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC
ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC
ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC ABLEBOND 2030SC
ABLEBOND 2030SC die attach adhesive has been formulated
for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes。压力低,低温快速固化 低弹性模量
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