ABLEBOND 2300
发布时间:2024年10月13日
详细说明
ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300
ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300
ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300 ABLEBOND 2300
ABLEBOND 2300超低水分的吸收,热/湿附着力高,低应力。
ABLEBOND 2300 electrically conductive adhesive is designed
for Pb-free PBGA and Array BGA packaging. This product is
able to withstand the high reflow temperatures necessary for
Pb-free solders @ 260°C.
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