公司名称：乐泰|乐泰胶水

乐泰 ABLESTIK QMI536NB-1A5乐泰胶水，电子胶水
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技术服务热线：021-51693135 / 021-22818476

产品描述
技术双马来酰亚胺树脂
外观米色
填料型PFE
间隔尺寸5密耳
靠性
治疗热固化
应用模附件
表面处理将裸铜引线框架或其他金属化引线框架裸露到裸机上
乐泰 ABLESTIK QMI536NB-1A5非导电芯片粘贴膏是专为需要良好介电强度的应用而设计的。
典型的固化性能
推荐治疗时间表
在175℃下在N 2中30分钟升温至175℃+ 30分钟
存储
将产品存放在未开封的容器中，干燥处。 存储信息可能在产品容器标签上显示。*佳存储：-40°C从容器中取出的材料在使用过程中可能会受到污染。不要将产品返回原始容器。
PRODUCT DESCRIPTION
Technology Bismaleimide Resin
Appearance beige
Filler Type PFE
Spacer Size 5 mils
Cure Heat cure
Application Die attach
Surface Finishes Bare copper leadframes or other metalized leadframes to bare backed die
乐泰 ABLESTIK QMI536NB-1A5 non-conductive die attach paste is designed for applications requiring good dielectric strength.
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
30 minute ramp to 175°C + 30 minutes @ 175°C in N2
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.Optimal Storage : -40 °C Material removed from containers may be contaminated during use.Do not return product to the original container