公司名称：胶水公司

ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/ECCOBOND E3503-1电子组装/工业胶水/电子组装胶水/工业用胶

技术服务热线：021-51693135 / 021-22818476

ECCOBOND E3503-1 is optimised for SMT dispense and themanufacturing of high volume assemblies. It has high adhesionto the substrate finishes commonly used in microelectronicsand will not adversely affect solder processes.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP) 50,000 to
70,000
Specific Gravity 1.2 to 1.25
Work Life:
@ 25oC, days 7
Shelf Life:
@ -25 to -18oC, months 6
@ 25oC, days 7
Hegman Fineness, micron 20 The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -25 to -18 °C ECCOBOND E3503-1针对SMT分配进行了优化制造大容量组件。它具有高附着力到微电子学中通常使用的底物并且不会对焊接工艺产生不利影响。
固化材料的典型特性
粘度@ 25℃，mPa•s（cP）50,000〜
70,000
比重1.2〜1.25
工作生活：
@ 25℃，第7天
保质期：
@ -25至-18℃，月6日
@ 25℃，第7天
赫格曼细度，微米20
以上治疗方案是指导性建议。治愈条件（时间和温度）可能会有所不同客户的经验和应用要求以及客户固化设备，烤箱装载和实际烘箱温度。
存储 将产品存放在未开封的容器中，干燥处。存储信息可能会在产品容器上显示标签。*佳储存：-25至-18°