ECCOBOND CA3150电子组装/工业胶水/电子组装胶水/工业用胶
发布时间:2024年07月14日
详细说明
ECCOBOND CA3150电子组装ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组ECCOBOND CA3150电子组/工业胶水/电子组装胶水/工业用胶
技术服务热线:021-51693135 / 021-22818476
CA3150 adhesive is designed to electrically interconnect diestraps, batteries, and other surface mount components. It issuitable for reel-to-reel production lines and high speed jettingor printing applications and allows exceptional fine pitchresolution. The long work life minimizes product waste andclean-up time, providing increased production efficiency.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity at 15 S-1 , mPa•s (cP)
Rheometer
13,000
Shear Thinning Index (Rheometer) 6
Work Life @ 24°C, days 2
Shelf Life @ -20°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
10 seconds @ 130°C at bondline
NOTE: CA3150 may be cured using a die bonder or any otherefficient method of rapid heat transfer. No pressure is required duringcure. No post cure required when curing in a convection oven.
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment,oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -20 °C
CA3150粘合剂设计用于电连接裸片带子,电池和其他表面贴装元件。它是适用于卷轴到卷轴生产线和高速喷射或打印应用程序,并允许特殊的细微间距解析度。长期的工作寿命*大限度地减少产品浪费清理时间,提高生产效率。
固化材料的典型特性
粘度为15 S-1,mPa•s(cP)
流变仪
13,000
剪切稀