公司名称：胶水公司

ABLEBOND 8175电子组装/工业胶水/电子组装胶水/工业用胶

技术服务热线：021-51693135 / 021-22818476

ABLEBOND 8175 is designed for solder replacement inmicroelectronic interconnect applications. This adhesive maybe used with thick film metallizations or traditional printedcircuit board surfaces. It is capable of resolving fine pitchresolution (0.02 inch) when printed using either a stainlesssteel mesh screen or a metal mask stencil.
MIL-STD-883
ABLEBOND 8175 meets the requirements of MIL-STD-883,Method 5011.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm) 2.0
Viscosity, Brookfield CP51, 25 °C, mPa•s (cP):
Speed 5 rpm 55,000
Work Life @ 25°C, weeks 2
Shelf Life @ -40°C, year 1
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 150°C
Alternative Cure Schedule
60 minutes @ 150°C (for bondlines <1 mil thick)
Alternative Cure Schedule 2
60 minutes @ 130°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
ABLEBOND 8175专为焊料替代微电子互连应用而设计。该粘合剂可用于厚膜金属化或传统印刷电路板表面。当使用不锈钢筛网或金属掩模模板打印时，它能够分辨细间距分辨率（0.02英寸）。
MIL-STD-883ABLEBOND 8175符合MIL-STD-883，方法5011的要求。
固化材料的典型特性
触变指数（0.5 / 5 rpm）2.0
粘度，Brookfield CP51,25℃，mPa&#8226;s（cP）：
速度5 rpm 55,000
工作生活@ 25°C，第2周
保质期@ -40°C，第1年
闪点 - 参见MSDS
典型的固化性能
治愈时间表
在150°C 30分钟
替代治疗计划
150°C时60分钟（对于<1密耳厚度的粘合线）
替代治疗附表2
130°C 60分钟
以上治疗方案是指导性建议。固化条件（时间和温度）可能会根据客户的经验和应用要求而变化，以及定制设备，烤箱装载和实际烤箱温度
存储将产品存放在未开封的容器中，干燥处。存储信息可能在产品容器标签上显