公司名称：胶水公司

HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装/HYSOL EO1016电子组装

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EO1016 is an epoxy encapsulate intended for applications requiring excellent handling properties.
The cured material survives severe thermal shock and offers continuous service to177 °C. It is particularly suited for use on transistors and similar semiconductors, can be used for encapsulation of watch ICs.
TYPICAL PROPERTIES OF UNCURED MATERIALViscosity, Brookfield - RVF, 25 °C, mPa•s (cap):Spindle 6, speed 2 62,000Spindle 6, speed 20 58,000Thixotropic Index 1.1Specific Gravity @ 25oC 1.56Shelf Life:@ 4oC, months 12@ -40oC, months 12Gel Time @ 121oC, minutes 4.5Pot life @ 25 °C, months 3Flash Point - See MSDSTYPICAL CURING PERFORMANCE Recommended Cure Schedule20 minutes @ 150°CAlternative Cure Schedule24 hours @ 93°CThe above cure profile is a guideline recommendation.
Cure conditions(time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
Differential Scanning CalorimetryInitial Temperature, °C 122Peak Temperature, °C 138Energy to break point, Joules 0.414TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Coefficient of Linear Thermal Expansion, ppm/oC:Below Tag 46Above Tag 140StorageStore product in the unopened container in a dry location. Storage information may be indicated on the product containerlabeling.
Liquid Storage - Liquids should be stored at 23°C or below, in closed containers.
If stored below 23°C, the material MUST be allowed to come to room temperature, in the sealed container, to avoid moisture contamination.
EO1016是一种环氧密封剂，适用于需要优异处理性能的应用。固化后